Laserfiche WebLink
TRINITY�ERD <br /> 6. Unless otherwise noted,insulation adhesive application rates are as follows. Ribbon or bead width is at the time of application;the ribbons/beads shall expand as noted in the manufacturer's published instructions: ' <br /> ➢ OlyBond S00(OB-500): Contfnuaus'Y.to 1-inch wide ribbons,12-inch o.c.using PaceCart or SpotShot application devices. <br /> ➢ 3M CR-20: Continuous 2X to 3l4-inch wide ribbons,12-inch o.c. <br /> ➢ Note: When multJple loyers(sJ of lnsuJa[1an and/ar coverboard ore insta0ed in rlbbon-applied adheslve,adhesive ri66ons shall be staggered from fayer-to-layer a distance of one-holj the rlb6on spacing. <br /> ➢ Note: The maxlmum edge distance from the odhesive�ibbon to the edge of the insulation board sholi be not/ess thon one-haljthe specijled rlbbons spocfng. <br /> 7. Unless otherwise noted,all insulations are flat stock or taper board of the minimum thickness noted. Tapered polyisocya�urete at the following thickness limitations may be substituted with the fotlowing Maximum <br /> • Design�Presfure�{fi/1DPi~iiPnitatioir�Irrno�case�sfiaiHtHesew6loes°bevsed#o�iricrease�the'tWDP�iistings itt�theafabfes;iatFie�iffME3Wl'rsting�Eselourmeet5•orpxeeeils�that=li5teti°fora•p�rtfct�larsystem�erthe•4ables;then-��— <br /> the thinner board listed below may be used as a drop-in for the equivalent thicker material listed In the table: <br /> D OlyBond 500(08500): MDP -315.5 psf (Min.0.5-Inch thick Poly I501,H-Shield or ENRGY 3) <br /> ➢ OlyBond 500(OB500): MPD -487.5 psf (Min.0.5-inch thick Poly I50 2 or ACFoam II) <br /> D 3M CR-20: MDP -117.5 psf (Min.1.0-inch thick) <br /> 8. Bonded polyisocyanurete i�sulation boards shall be maximum 4 x 4 ft. <br /> 9. For mechanically attached components or partialiy 6onded insulatfon,the maximum design pressure for the selected assembly shali meet or exceed the Zone 1 design pressure determined in accordance with FBC <br /> Chapter 16,and Zones 2 and 3 shall employ an attachme�t density designed by a qualified design proFessional to resist the elevated pressure criieria. Commonly used methods are RAS 117,FM LPDS 1-29 and <br /> ANSI/SPRI WD3. Assemb�ies marked with an asterisk•carry the limkations set forth in Section 2.2.1.5.1(a)of FM LPDS 1-29 far Zone 2/3 enhancements. <br /> 10. �or assembiies with all components fully bonded in place,the maximum design pressure for the selected assembly shall meet or exceed critical design pressure determined in accordance with FBC Chapter 16,and no <br /> rational analysis is permitted. <br /> 11. For mechanically attached components over existing decks,fasteners shall be tested in the existing deck for withdrawal resistance. A qualiffed design professional shall review the data for comparison to the <br /> minimum requirements for the system. Testing and analysis shall be in accordance wlth TA5105 or AN51/SPRI FX-1. <br /> 12. For existing substrates in a bonded recover or re-roof installation,the existing roof surface or existing roof deck shall be examined for compatibility and bond performance with the selected adhesive,and the existing <br /> roof system(for�ecover)shall be capable af resisting projec[design pressures on its own merit to the satisfaction of the AHI,as documented through field uplift testi�g in accordance with ASTM E407,FM LPD51-52, <br /> ANSI/SPRI IA-1 or TA5124. <br /> 13. For System Type D,steel deck applicatlons,the roof inembrane shall 6e run with iu length perpendicular to the steel deck flutes. <br /> 14. For Recover Applications usin�System Type D,the insulation is optional. Alcernatively,min.0.5-inch H-Shield HD or min.0.25-inch to 0.625-inch Dens Deck,Dens Deck Prime,SECUROCK Gypsum-Fiber Roof Board or <br /> SECUROCK Glass-Mat Roof Board or min.3/8-inch Insulfoam R-Tech EPS or Fan-Fold may be used as a separator board,preliminarily attached prior to roof cover installation. The existing roof system shall be suitable <br /> for a recover application. . <br /> 15. For adhered membrane systems,side laps shall be minimum 3-inch wide sealed with min.1.5-inch heat weld. Membrane adhesive app�ication rates are as follows: <br /> ➢ Mule-Hide TPO-c with Mule-Hide TPO-c Bonding Adhesive in a contact appflwtion at rate of 60 ft�/gal. <br /> D Mule-Hide TPO-c with W BBA 2QD0 In a contact application at rate of 120 ft'/gal. , <br /> ➢ Mule-Hide TPO-c Fleece Back with W BBA 2000 in a wet-lay applicatlon at a rate of 120 ft2/gal. <br /> 16. For membrane systems attached using TPO 10-inch Pressure-Sensitive RUSS,the undenide of the membrane which comes in contact with the tape shall be primed with HP-250 Primer. The membrene shall be <br /> secured by placing the primed portion onto the tape portion of the TPO SO-inch Pressure-Sensitive RU55 and roll wRh a steel hand roller to ensure contact. <br /> 17. For bonded membrane sysYems,unless otherwise noted,reference to"Mule-Htde TPO-c"membrane below also inciudes"Mule-Hide TPO-c EXTRA". <br /> 18. "MDP"=Maximum Design Pressure is the result of testfng for wfnd load resistance based on allowable wind loads. Refer to FBC 1609 for determinatlon of deslgn wind loads. <br /> ExteHor Research and Design,LLC.d/b/a Triniry�ERD Evaluatfon Report M15060.06.09-R3 for F112772-R3 <br /> Certiflcate of Authorl[ation N9503 Revision 3'03/18/2015 <br /> Prcpared by: RobeK Nieminen,PE-59166 Appendix 1,Page 2 of 18 <br />