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r--�,,-�^"- <br /> r 9 <br /> ! <br /> �, �� ,> <br /> � �..._ <br /> +����.�TRIt�IT'��E�� <br /> 7. Unless otherwise noted,all insulations are flat stock or taper board of the minimum thickness noted. Tapered polyisocyanurate at the follawing thickness limitations may be substituted with the following Maximum <br /> pesign Pressure(NiDP}iimiYaiions. in no case sha(!these values be used to'increase'the MDP{isYi�gs in the ta6les;rather if MDP listing below meets or e�cceeds that listed for a particular system in the tables,then <br /> the thinner board listed belaw may be used as a drop-in for the equivalent thicker material tisted in the tabie: <br /> A OlyBond 500: MDP -1$7.5 psf (Min.0.5-inch thick) <br /> 8. Bonded polyisocyanurate insutation boards shail be maximum 4 x�ft, <br /> 9. Far mechanically attached components or partially banded insulation,the maximum design pressure for the selected assembly shall meet ar exceed the Zone 1 design pressure determined in accordance with FBC <br /> Chapter 26,and Zones 2 and 3 shail empEoy an attachmest density designed by a quaiified design professianal to resist the elevated pressure criteria. Commanly used methods are RAS 317,FM l.PDS 1-29 and <br /> AN51/SPRI WDS. AssembAes marked with an asterisk*carry the limitations set forth in Section 2.2.1.5.1(a)of FM 4PD51-29 for Zone 2/3 enhancements_ <br /> 10. For assembties with a3t companents Pully bonded in pface,ttse maximum design gressure far the selected assemhly shalt meet or exceed criYicai design pressure determiaed in accordance with�BC Chapter 16,and no <br /> rational analysis is permitted. <br /> 31. For mechanically attac6ed componettis over exEsting decks,fasteners stra(i be tested in the eacisting deck far wiYhdrawai resistance. A quatified design professiona!shali review the data for comparison to the <br /> minimum requirements for the system. Testing sfiall be in accordance wRh TAS 105 or ANSijSPRf FX-1. <br /> 12. For existin$substrates in a banded recaver or ce-roof instatlation,ihe existing raof surface or existing roof deck shall be examined for compatibility and bond performance with the selected adhesive,and the existing <br /> roof system(for�ecover}shail be capable of resisting project design pressures on its own merit ta the satisfaction of the AH3,as documented through field uplift testing in accordance with ASTM E907,FM I.PDS 1-52, <br /> ANSI/SPRI IA-1 or TAS 124. <br /> 13. For System Type D,steel deek applications,the raof inembrane sfiall be run with its Ier�gth perpenBicutar to the steet dezk fluEes. <br /> 14. For Recover Applications using System Type D,the Insulation is optional.Alternatively,min.0.25-inch to 0.625-inch Dens Deck,Dens Deck Prime,SECUROCK Gypsum-Fiber Roof Board or SECUROCK Glass-Mat Roof <br /> Board may be used as a separator board,preliminarily attached prior to raof cover instaltation. The existing roof system shali be suita6le for a recover application. <br /> 15. For membrane attachment using batten-strips,end laps shall be spliced with sufficient dimension to allow for minimum 2-fasteners at each batten-strip lap. <br /> 26. Side taps sha8 6e seated in accordance with Mule-Hide requisements: <br /> S� Primed with Mule-Hide Tape Primer and adhered with Mule-Hide In-Seam Tape <br /> D Cleaned with Mu1e-Hide Splice Cleaner and adhered with IYltste-Hide Black or White Splice Adhesive. <br /> 17. Mem6rane adhesive application rates are as follows: <br /> ➢ IVIuIe-Hide Bonding Adhesive in a contact application at combined rate of 60 ftZf gai. <br /> ➢ WBBA 2000 In a contact application at a combined rate of 50 to 60 ftZ/gat. <br /> ➢ Mule-Hide Acrylic Water Base Bonding Adhesive in a substrate application at rete of 100 ftx/gal. <br /> 18. "MDP"=Maximum Design Pressure is the result of testing for wind Ioad resistance based on allowabte wind toads. Refer to FBC 1609 for determination of design wind loads. <br /> Exterior Research and pesign,LLC.d/b/a Trinity� ERD Evaluation Report M3124Q,11.09-R5 for FL107D3-R5 <br /> Certifcate of Authorizatiorr#4503 Revision 5:03/20/2015 <br /> Prepared by: Robert Nieminen,PE-59166 Appendix 1,Fage 2 of 12 <br />