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L <br /> ,= a� <br /> ;_„^.`��w"�'Y � <br /> �� ���,.a_ ' <br /> ���.� `TR.��BY°Y��R� <br /> 7. LJnless otherwise noted,all fnsulat(ons are flat stock or taper 6oard of the minimum thickness noted.Tapered palyisoryanurate at the following thickness limitations may 6e substituted with the following Maximum � <br /> Design Pressure�MDPJ limitations. in no.case shall[hese values be used to'lncrease'the MDP Iistings in the tables;rather(f MDP listing below meets or exceeds that Iisted for a particular system in the tables,then <br /> the thinner 6oard listed below may be used as a drop-in for[he equlvalent thicker materlal Iisted In the ta61e: <br /> D OlyBond 500: MDP -157.5 psf (Mln.0.5-inch thick) <br /> 8. Bonded polyisocyanurete insulation 6oards shall he maximum 4 x 4 ft. <br /> 9. For mechanically attached components or partially bonded insulation,the maximum design pressure for the selected assembly shali meet or exteed'the 2nne 1 design pressure determi�ed in accordance with FBC <br /> Chapcer 16,and Zones 2 and 3 shall employ an attachment density designed by a qualified design professional to resist the elevated pressure criterla, Commonly used methods are RAS 117,FM LPDS 1-29 and <br /> AN51/SPRI WDS. Assemhl(es marked with an asterisk'carry the Iimitatfons set forth in Sectlon 2.2.1.5.1(a)of FM LPDS 1-29 for 2one 2/3 enhancements. <br /> S0. For assemblles with all components fully bonded In place,the maximum design pressure farthe selected assembly shall meet ar exceed critical design pressure determined In accordance with F8C Chapter 16,and no <br /> ratfonal analysls is permitted. <br /> il. For mecha�ically attached companenu over existing decks,fasteners shall he tested in the existing deck for.withd2wal resistance. A qualified design professional shall review the data for comparison ta the <br /> minlmum requirementr for the system.Testing shall be in accordance wlth TA5105 or AN51/SPRI FX-1. <br /> 12. For existing suhstretes in a bonded recover or rrroof fnsullation,she existing roof surface or exisUng roof deck shall be examined for compatibility and bond perforrnance with the seleded adhesive,and the exlsting <br /> a ect desl n ressures on Its own merit to the satlsfaction of the AHI,as documented through field uplift testing In accordance with ASTM E907,FM LPOS i-52, <br /> roof system(far recover)shall be capable of resisting pr( 6 P <br /> AN51/SPRI IA-1 or TA5124. <br /> 13. For System Type D,steel deck applfcatians,the roof inembrane shall he run with Its length perpendlcular to the steel deck flutes. <br /> 14. For Recover Applfcations using System Type�,the insula[ion is optlonal.Alternatively,min.0.2Slnch to 0.625•inch Dens Deck,Dens Detk Prlme,SECUROCK Gypsum-Fiber Roof Board,pr SECUROCK Glass-Mat Roof <br /> Board ma be used as a se arator 6oard,preliminarily attached prior to roof cover installa[ion.The existing roof system shall he suitable for a recover appli�ation. <br /> 4 P . <br /> 15. For membrane attachment using batten-strips,end laps shall be spliced wfth sufficient dfinension to allow for minimum Z-fasteners at each 6atten-strip lap. <br /> 16. Slde laps shall be sealed In actordance with Mule-Hide requfrements: <br /> D Primed with Mule-HldeTape Primer and adhered with Mule-Hide In-Seam Tape <br /> D Cleaned with Mule-Hide Spllte Cleaner and adhered with Mule-Hide Black or White Splice Adhestve. <br /> 17. Memhrane adhesive application rates are as follows: <br /> D Mule-Hide Bonding Adhesive in a contact application at combfned rete of 60 ft'/gal. <br /> ➢ WBBA 2000 fn a cantact appliwtlon at a combined rete of 50 to 60 ft'/gal. <br /> � D Mule-Hide Acrylic Water Base Bonding Adliesive In a su6strate application at rate of 100 ft3/gal. <br /> 18. "MDP"=Maximum Design Pressure is the resuit of testing for wind load resistan�e based on allowa6le wind loads.Refer to FBC 1609(or determinatian of design wind toads. <br /> Exterior Research and Design,LLC.d/b/a Trinity�ERD Evaluation Report M31240.11.09-RS for fL10703-R6 <br /> . Revisfon 5:03/20/2015 <br /> Certlfiwte of Authorization i19503 <br /> Prepared by: Robert Nieminen,PE-59166 Appendix 1,Page 2 of 12 <br />