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I <br /> :� a <br /> =.��. �(� ('� n i(�p'q <br /> .' t7 Lt V.�s1 �t{ 6 t7 j�afl�►� ' <br /> 6. Unless othetwise nated,insulation adhes[veapplication rates are as follows. Ribbnn or bead width is at the time af application;the ribbonsJbeads sfiafl eacpand as nated in the manufacturer's published ieistructions: , <br /> 3 dly8and SIIO(08-500): Continuous�to 2-inch wide ribbons,22-inch a.c asing PaceCart or SpatShot appliqtion devices. <br /> A SM CR-20: Continuous 21�to 3�4-inch wide H6bons,l2-inch o.c. <br /> D litote: Whe»muitipie tayers/s)af insulation ond/or coverbaard are tttsta!!ed in rlb6ot+-appfled adhesive,adheslve ribBons shall be stnggered from fayer-to-layer p distance of one-haff the ribbon spocfng. <br /> D Note: The rnaximum edge dfsmace from the adhesive ribbo»ta the edge af the insutafkin 6onrd shaii be not less thrrn one-hr�t,�the speci}!ed tibbans spnrirtg. <br /> 7. Unless athenuise noted,ail insu(atlons are flat stack or ta}ser board of the minirnurts t(tickness naied. Tapered polylsocyanurate at the foAowing thickness limitakions may be substituted wlth the fallqwing Maximum <br /> Oesign Fressure(MOP)iimitatians. In no pse shaii these values be used ta'increase'the MpF listings in the tables;rather if MDP listing below meets or exceeds that listed for a particular s�stem in the tab(es,then <br /> the th inner baard listed betaw may be used as a drop-in for the equivalenk thicker materia!tisted in the table: <br /> ➢ OlyBond Sp0{08500): MDP -315.5 psf (Min.0.5-inch thick Poly I501,H-Shietd or ENRGY 3j <br /> 9 OiyBond 5p0 j08500): MPP -487.5 psf (Mfn.a.5-jnch thick Poly I50 2 or ACFoam Ilj <br /> 9 3M CR 20: MDP -11�.5 psf {Min.1.0-inch thic!<j <br /> 8. Bonded polyisocyanurate insutafion boards shali be maximum 4 x 4 ft. <br /> 9. For meehanica�ly attached components or part►ally tronded insulation,the maximum design pressure for the selecYed assembly shall meet or exceed the Zone 1 design pressure determineCi in aaordante with F8C <br /> Chapter 16,and Zones 2 and 3 shat!empCoy an attachmerrt der�sity deslgned by a qualified design professianal to resist the elevated pre�sure criteria. Cammonly used methods are ttAs il�,FM tPDS T-29 and <br /> ANSIjSPRf Wpl, Assembiies marked urith an asteris!<''carry the limttatioqs set faeth fn Section 2,2.1.5.2{a}of PM LPD51-29 for Zone 2/3 enha�cements, <br /> 14. For assemblies with al!camponents fuily bonded in place,the maximum design pressure for the selected assembty shatl meet or ex�eed critical design pressure detarmined in accaMance with FBC Chapter 16,and no <br /> ratiorta!ana{ysis is permitted. <br /> 11. For mechanica�ly attached components over existing decks,fiasteners shalt be tested in the existing deek for withdrawat resistance. A gual�ad design professionaf sha{! review the data far comparison ta the � <br /> minimum requ�remenYs for the system. Testing and ana►ysis shall be in accordance witit TAS 105 or ANSI/SPRI F3t 2. <br /> 12. For existing supstrates in a bonded recaver nr re-raof installatian,the existing raaf surFace or existiog t�oof deck shaii be examined for compatibi{ity a»d bond performence with the selected adhesive,and the existing <br /> roof system(for recover)shall be capa6le of resisting project design pressures on its own merit to#he satisfaction of the AH1,as documented through fleid uplfft testing in accardance with RS7M E9D7,FM 1PA51-S2, <br /> ANSI/SPRI IA-1 orTAS 124. � <br /> i3. Far System Typ�p,steei dectc appiications,the roaf inembrane shati be run with its iength perpendfcutar to the steel deck#lutes. <br /> 14. For Recover App{fcations using System Type D,the insulaiian Es optional. Altematively,min_4.5-inch N-Shield HD or min.0.25-inch to Q_625-inch pens Deck,Dens Deck Pnme,SECURpCtC Gypsum-Ftber Rapf Board or <br /> SECUROCK 6fass-Eviat RaaE aoard or min.3�8-inch lnsuifaam R-Tech EPS or Fan-Fatd Inay be used as�separator board,prelIminarily attached prior to raof cover insta(lation. The extsting roof system shall be suitabte <br /> for a recover apptication. <br /> 15. For adhered membrane systems,side 12ps sha�l be minimum 3-inch wide sealed with min.1.5-inch heat weld. Membrane adhesive appiication rates are as follows: <br /> r Mule-Hide TPO-c witfi Mufe-Hide TPA-c Bonding Adhesive in a cantact appiicatian at rate of SQ ftZ/gal. <br /> l� Mule-Hide TPO-c with WBBA 2000 in a contact application at rate of 120 ft2Jgal. <br /> r� Mule-Hide TFO-c fieece Bac&with WBSA 2000 in a wet!ay app{ication at a rate of 120 ft'1$al. <br /> 16. For membrane systems attached using TPO 10-lnch Pressure-Sensitive RUSS,the underside of tbe membrane whtch cqmes in contact with the tape shall be primed with HP-250 Primer, ihe membrane shalE be <br /> secured by pl�c�ng the primed portion onto the tape portion af the TPQ x0-}nch Pressure-Sensitive RU5S and roll with a skeel hand roffer to ensure contad. <br /> 17. Far bonded membrane systems,unless otherwise noted,reference to"Mu�e-Nide TPO-c"membrane below a(so includes"Mule-ii€de TPQ-c EXTRP�". <br />, 18. "MDP"=Maximum Design Pressure is#fie result of testing for wind laad resistance based on a!(owable wir�d faads. Refer to FSC 1609 for determination oE design wind loads. <br /> E�cteriar Research and Desi�n,!.lC.d(b/a Tctnity�ERD Evaluation Report MISd60.06A9-R3 for Fi.12Tl2•R3 <br /> Certiflcate of Authorix�tion tt95a3 Revision 3;03JSSj2015 <br /> Prepared by:Rabert Nieminen,PE-59166 AppGad`sx 1,Pa$e 2 af SS <br />